How can I help with the Competence center?

The CC will provide support on you initial steps in order to provide answers to your questions, identify experts and organizations to accelerate your journey from idea to the final products in a form or semiconductor, photonic chip or quantum device.

There are several ways how you can get in contact with CC Chip.si: Contact our main office: CC Chip.si main office located at the Faculty of Electrical Engineering, Tržaška 25, 1000 Ljubljana, Slovenia, office@cc-chip.si, Phone: +386 (0)1 476 8850 Reach out to contact persons: Prof. Dr. Janez Krč, project coordinator Jurij Podržaj, technical lead: Jurij.Podrzaj@fe.uni-lj.siKlara Anžur, business lead: Klara.Anzur@fe.uni-lj.siVia consortium partners – here. You can also subscribe to the CC Chip.si weekly newsletter and follow our activites on LinkedIN.

What services you offer?

CC Chip.si provides services such as: Provide and execute Trainings, (https://cc-chip.si/offer/#trainings) -> Courses catalogue (https://cc-chip.si/wp-content/uploads/2026/01/CC-Chip.si-COURSES-CATALOGUE-V1.0-1.pdf) Organise Workshops and conferences (https://cc-chip.si/offer/#WORKSHOPS) Access to the advanced Technology infrastructure and equipment, (https://cc-chip.si/offer/#TECHNOLOGY) Consultancy on equipment access, proof-ofo-concept and others (https://cc-chip.si/offer/#CONSULTING) Networking on natilan and EU level to strengthen EU semiconductor ecosystem (https://cc-chip.si/offer/#NETWORKING)

How can I get in touch with other Comepetnce centers in Europe?

There are 30 CC in EU; each or CC can be either reach directly, via aCCCess and /or via CC Chip.si main office.

What are the prices of your services?

For further details and conditions, please follow the link to our price list that is COMMING SOON and please contact CC Chip.si main office here.

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Procesi sestavljanja fotonskih komponent: od priprave čipa do optičnih vmesnikov

This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. This webinar is the second of three webinars about packaging technologies for photonics. When: 2nd April 2026, from 2 pm to 3:30 pm CEST Where: Online event […]

INTERCHIP tečaj: praktična MEMS mikroizdelava v okolju čistih prostorov

When: June 23th – June 24th, 2026 application deadline: 31st March, 2026 Where: Organised by MC2, Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Göteborg, Sweden & GOMOD AB (Sweden) About the training: Microfabrication and electrical characterization (S-parameters) of a MEM piezoelectric device microfabrication in the tools and facilities at the department of Microtechnology and […]

Dresden Microelectronics Academy – TU Dresden (Germany)

An intensive summer academy highlighting micro- and nanoelectronics technologies in one of Europe’s largest microelectronics hubs. When: applications opens in Spring 2026 Where: TU Dresden (Germany) Who can apply What can you expect Learn more here.

Advanced PDK Workshop: N2–A14 Nanosheet Pathfinding & Applications

2-day workshop with hands-on practical sessions (limited spaces) Course overview This intensive two-day advanced workshop provides a deep dive into N2 and A14 Nanosheet Pathfinding-PDK (P-PDK) technologies, with a strong focus on digital design flows and Back-Side Power Distribution Networks (PDN). Participants will gain a comprehensive understanding of: The course combines expert-led lectures with hands-on […]