Photonic Assembly Processes: From Die Prep to Optical Interfaces
This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. This webinar is the second of three webinars about packaging technologies for photonics. When: 2nd April 2026, from 2 pm to 3:30 pm CEST Where: Online event […]
INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment
When: June 23th – June 24th, 2026 application deadline: 31st March, 2026 Where: Organised by MC2, Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Göteborg, Sweden & GOMOD AB (Sweden) About the training: Microfabrication and electrical characterization (S-parameters) of a MEM piezoelectric device microfabrication in the tools and facilities at the department of Microtechnology and […]
Dresden Microelectronics Academy – TU Dresden (Germany)
An intensive summer academy highlighting micro- and nanoelectronics technologies in one of Europe’s largest microelectronics hubs. When: applications opens in Spring 2026 Where: TU Dresden (Germany) Who can apply What can you expect Learn more here.
Advanced PDK Workshop: N2–A14 Nanosheet Pathfinding & Applications
2-day workshop with hands-on practical sessions (limited spaces) Course overview This intensive two-day advanced workshop provides a deep dive into N2 and A14 Nanosheet Pathfinding-PDK (P-PDK) technologies, with a strong focus on digital design flows and Back-Side Power Distribution Networks (PDN). Participants will gain a comprehensive understanding of: The course combines expert-led lectures with hands-on […]
More Trainings Coming Soon
Additional training courses in the field of chips, electronics and semiconductor technologies are currently in preparation.
