
Webinar: Leveraging the PIC tapeout value chain through the Luceda Photonics Design Platform
Webinar will introduce how to leverage the PIC tapeout value

Webinar will introduce how to leverage the PIC tapeout value

Prenesite razpis za prispevke tukaj.

Lecturer: Prof. Dr. Matjaž Spreitzer (Head of Advanced Materials Department,

About the webminar: Are you a tech-student looking to deepen

Vabimo zagonska podjetja k udeležbi na webinarju, kjer bo predstavljen Chips Venture Forum 2026 (CVF)

the second webinar of the aCCCess series dedicated to European

SEMICON Europa je največja evropska platforma na področju elektronike, ki povezuje industrijske deležnike.

EuroCDP is launching its Venture Building Programmes — acceleration and
Univerza v Ljubljani
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits
University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS
University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization
Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design
CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)