Webinar will introduce how to leverage the PIC tapeout value chain through the Luceda Photonics Design Platform.
About the webminar:
As adoption of integrated photonics increases for hyperscaler applications, achieving high manufacturing yield remains a challenge due to complex requirements. High yield requires a dual approach: designers must implement variation-robust workflows, while foundries must improve fabrication processes and statistical data gathering. The Luceda Photonics design platform facilitates this by bridging multiple ecosystem entities (including simulation vendors, foundries, and assembly houses) into a unified tapeout flow. This seminar details the stages of a PIC tapeout, demonstrating how Luceda enables designers to account for subsequent manufacturing steps and achieve a PIC which behaves as expected.
Company description:
Luceda Photonics is a leading provider of photonic integrated circuit (PIC) design software and services. The Luceda Photonics Design Platform enables designers to design, simulate, verify, and optimize photonic PICs and empowers them to achieve their tape-out quickly, getting their designs right the first time. Luceda Photonics supports access to a wide range of foundry PDKs, ADKs and TDKs, and is active in various application areas, such as the data and telecom market, lidar for self-driving cars, quantum computing, sensing and biosensing, and more.
Kje:
On-line
Kdaj:
May 18th, 2026, from 9:00 AM to 11:00 AM (CEST)
Contact:
For all information contact CC-Chip.si main office.
E-mail: office@cc-chip.si
Costs: Free of charge.
Registracija:
required, please register here.
