
Webinar: Leveraging the PIC tapeout value chain through the Luceda Photonics Design Platform
Webinar will introduce how to leverage the PIC tapeout value

Webinar will introduce how to leverage the PIC tapeout value

Lecturer: Prof. Dr. Matjaž Spreitzer (Head of Advanced Materials Department,

About the webminar: Are you a tech-student looking to deepen

Join an upcoming webinar presenting the Chips Venture Forum 2026,

SEMICON Europa is the largest European electronics platform connecting industry

EuroCDP is launching its Venture Building Programmes — acceleration and

An interactive workshop focused on strengthening cybersecurity and supply chain
University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits
University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS
University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization
Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design
CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)