How can I help with the Competence center?

The CC will provide support on you initial steps in order to provide answers to your questions, identify experts and organizations to accelerate your journey from idea to the final products in a form or semiconductor, photonic chip or quantum device.

There are several ways how you can get in contact with CC Chip.si: Contact our main office: CC Chip.si main office located at the Faculty of Electrical Engineering, Tržaška 25, 1000 Ljubljana, Slovenia, office@cc-chip.si, Phone: +386 (0)1 476 8850 Reach out to contact persons: Prof. Dr. Janez Krč, project coordinator Jurij Podržaj, technical lead: Jurij.Podrzaj@fe.uni-lj.siKlara Anžur, business lead: Klara.Anzur@fe.uni-lj.siVia consortium partners – here. You can also subscribe to the CC Chip.si weekly newsletter and follow our activites on LinkedIN.

What services you offer?

CC Chip.si provides services such as: Provide and execute Trainings, (https://cc-chip.si/offer/#trainings) -> Courses catalogue (https://cc-chip.si/wp-content/uploads/2026/01/CC-Chip.si-COURSES-CATALOGUE-V1.0-1.pdf) Organise Workshops and conferences (https://cc-chip.si/offer/#WORKSHOPS) Access to the advanced Technology infrastructure and equipment, (https://cc-chip.si/offer/#TECHNOLOGY) Consultancy on equipment access, proof-ofo-concept and others (https://cc-chip.si/offer/#CONSULTING) Networking on natilan and EU level to strengthen EU semiconductor ecosystem (https://cc-chip.si/offer/#NETWORKING)

How can I get in touch with other Comepetnce centers in Europe?

There are 30 CC in EU; each or CC can be either reach directly, via aCCCess and /or via CC Chip.si main office.

What are the prices of your services?

For further details and conditions, please follow the link to our price list that is COMMING SOON and please contact CC Chip.si main office here.

OLD – Offers

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OUR OFFERS

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Check our Pricelist HERE

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TRAININGS

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Introduction

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CC Chip.si trainings

ACTIVE

Photonic Assembly Processes: From Die Prep to Optical Interfaces

This session dives into the core steps of assembling photonic

ACTIVE

INTERCHIP School on Sustainable Integrated Sensors and Systems

When: June 8th – June 11th Application deadline: 1st March,

ACTIVE

INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment

When: June 23th – June 24th, 2026 application deadline: 31st

Other trainings

ACTIVE

Photonic Assembly Processes: From Die Prep to Optical Interfaces

This session dives into the core steps of assembling photonic

ACTIVE

INTERCHIP School on Sustainable Integrated Sensors and Systems

When: June 8th – June 11th Application deadline: 1st March,

ACTIVE

INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment

When: June 23th – June 24th, 2026 application deadline: 31st

Education

ACTIVE

Ugrade of integrated photonics course at UL FE

At the University of Ljubljana, Faculty of Electrical Engineering, the

TECHNOLOGY

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Introduction

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Infrastructure access

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