Newsletter, 27 Feb 2026
The latest KC Chip.si weekly newsletter is now available. Download it to explore recent news, events and training opportunities related to chips and semiconductor technologies, as well as key developments shaping the European semiconductor ecosystem.
𝗪𝗲𝗯𝗶𝗻𝗮𝗿: 𝗚𝗿𝗲𝗲𝗻 𝗖𝗵𝗶𝗽𝘀, 𝗖𝗹𝗲𝗮𝗻 𝗙𝘂𝘁𝘂𝗿𝗲
When: Monday, 23 March,14:00–16:00 CET Where: Online About the training: After launching the BioPCB courses by Budapest University of Technology and Economics on the ECSA e-learning platform, we wanted to create a space to go deeper and connect theory with real engineering challenges. That’s why this webinar — organized by our fantastic Student Ambassadors Laura […]
Photonic Assembly Processes: From Die Prep to Optical Interfaces
This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. This webinar is the second of three webinars about packaging technologies for photonics. When: 2nd April 2026, from 2 pm to 3:30 pm CEST Where: Online event […]
INTERCHIP School on Sustainable Integrated Sensors and Systems
When: June 8th – June 11th Application deadline: 1st March, 2026 Where: INFRACHIP at Tyndall National Institute in association with European Chips Skills Academy (ECSA), CONNECT Research Centre for Future Networks,, FERNS- MSCA doctoral network & the SiNANO Academy About the training: This school will offer a programme combining lectures, hands‑on sessions, and expert discussions. It […]
INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment
When: June 23th – June 24th, 2026 application deadline: 31st March, 2026 Where: Organised by MC2, Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Göteborg, Sweden & GOMOD AB (Sweden) About the training: Microfabrication and electrical characterization (S-parameters) of a MEM piezoelectric device microfabrication in the tools and facilities at the department of Microtechnology and […]
ECS Summer School – European Chips Skills Academy
A multi-day residential summer school introducing students to semiconductor systems, IC design, and ECS technologies, organised within the ECSA framework. When: August 23th – August 28th, 2026 Application deadline: 29 March 2026 Where: University Residential Centre, University of Bologna, Bertinoro, Italy About the programme: Via lectures, demonstrations and interactive activities, the program will introduce some of the […]
Dresden Microelectronics Academy – TU Dresden (Germany)
An intensive summer academy highlighting micro- and nanoelectronics technologies in one of Europe’s largest microelectronics hubs. When: applications opens in Spring 2026 Where: TU Dresden (Germany) Who can apply What can you expect Learn more here.
SEMICON Europa 2026
SEMICON Europa is the largest European electronics platform connecting industry leaders across the entire design and manufacturing supply chain. It is held annually, alternating with productronica and electronica, and is organized by SEMI Europe. Organized by SEMI Europe, SEMICON Europa co-located with productronica / electronica is the largest European electronics platform connecting industry leaders across the […]
SEMI – Supply Chain Security Assurance of Semiconductor Manufacturing
An interactive workshop focused on strengthening cybersecurity and supply chain assurance in semiconductor manufacturing. The session introduces the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) and its standardized Semiconductor Supplier Cybersecurity Assessment (SSCA) framework, offering insights into evidence mapping for compliance, best practices aligned with widely accepted cybersecurity functions, and collaborative discussion with industry experts. Key information […]
Advanced PDK Workshop: N2–A14 Nanosheet Pathfinding & Applications
2-day workshop with hands-on practical sessions (limited spaces) Course overview This intensive two-day advanced workshop provides a deep dive into N2 and A14 Nanosheet Pathfinding-PDK (P-PDK) technologies, with a strong focus on digital design flows and Back-Side Power Distribution Networks (PDN). Participants will gain a comprehensive understanding of: The course combines expert-led lectures with hands-on […]
