How can I help with the Competence center?

The CC will provide support on you initial steps in order to provide answers to your questions, identify experts and organizations to accelerate your journey from idea to the final products in a form or semiconductor, photonic chip or quantum device.

There are several ways how you can get in contact with CC Chip.si: Contact our main office: CC Chip.si main office located at the Faculty of Electrical Engineering, Tržaška 25, 1000 Ljubljana, Slovenia, office@cc-chip.si, Phone: +386 (0)1 476 8850 Reach out to contact persons: Prof. Dr. Janez Krč, project coordinator Jurij Podržaj, technical lead: Jurij.Podrzaj@fe.uni-lj.siKlara Anžur, business lead: Klara.Anzur@fe.uni-lj.siVia consortium partners – here. You can also subscribe to the CC Chip.si weekly newsletter and follow our activites on LinkedIN.

What services you offer?

CC Chip.si provides services such as: Provide and execute Trainings, (https://cc-chip.si/offer/#trainings) -> Courses catalogue (https://cc-chip.si/wp-content/uploads/2026/01/CC-Chip.si-COURSES-CATALOGUE-V1.0-1.pdf) Organise Workshops and conferences (https://cc-chip.si/offer/#WORKSHOPS) Access to the advanced Technology infrastructure and equipment, (https://cc-chip.si/offer/#TECHNOLOGY) Consultancy on equipment access, proof-ofo-concept and others (https://cc-chip.si/offer/#CONSULTING) Networking on natilan and EU level to strengthen EU semiconductor ecosystem (https://cc-chip.si/offer/#NETWORKING)

How can I get in touch with other Comepetnce centers in Europe?

There are 30 CC in EU; each or CC can be either reach directly, via aCCCess and /or via CC Chip.si main office.

What are the prices of your services?

For further details and conditions, please follow the link to our price list that is COMMING SOON and please contact CC Chip.si main office here.

EuroSimE 2026 – 27th Intentional conference on Thermal, Mechanical, and Multiphysics simulation and experiments in Microelectronics and Microsystems

27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

EuroCDP is launching its Venture Building Programmes — acceleration and incubation support for European fabless startups, with access to IC design tools, expert support, and a network focused on building the next generation of semiconductor ventures in Europe.

When: 19-22 April 2026

Application deadline:

Where: Warsaw, Poland

Registration: https://www.eurosime.org/registration/

About the programme:

The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Professional training courses will be offered on April 19, 2026 followed by three days of technical sessions (April 20–22, 2026) comprising of oral and poster presentations, including industry keynote talks by invited speakers. In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation/optimization software will showcase their latest features.

Cost: 950,00 EUR

More about the event here: https://www.eurosime.org/