This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. 

This webinar is the second of three webinars about packaging technologies for photonics.

When: 2nd April 2026,  from 2 pm to 3:30 pm CEST

Where: Online event

About the training: This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot-size converters, creation of robust optical interfaces, and approaches to thermal packaging. Attendees will gain a clear understanding of the full photonic assembly workflow and the process controls that enable high-quality, repeatable results.

Cost: This webinar is free

More about event: photonixFAB webinars on packaging technologies for photonics: Part 2 – Training – ePIXfab

Registration possible on the website photonixFAB webinars on packaging technologies for photonics: Part 2 – Training – ePIXfab