Permanently open courses (Nanocenter)

A selection of advanced hands-on training courses is available at Nanocenter on the ongoing basis.

Available training courses:

Fundamentals of superconducting device fabrication

Course will provide training in fabrication of superconducting Josephson junction devices, which are the main building blocks of superconducting quantum processors, travelling wave parametric amplifiers, SFQ logic circuits and more.

Provider: Nanocenter, Duration: 40 hours (Flexible), Level: Advanced

Characterization of superconducting, semiconducting and emergent devices and samples

Course will provide training in sample preparation, cryogenic and vacuum system handling, and transport measurements at room and cryogenic temperatures. Course will cover basic 2-point and 4-point resistance measurements as well as more advanced magnetoresistance measurements. Advanced users can also be trained in a low-temperature scanning tunnelling microscopy technique used for microscopic characterization of electrical and structural properties of devices and samples.

Provider: Nanocenter, Duration: 40 hours (flexible), Level: Intermediate

Cryomemory device fundamentals

Course will provide basic knowledge on the novel type of cryomemory based on resistance switching in a correlated 2D material, showcasing its advanced characteristic. Course includes hands-on measurements at cryogenic temperatures.

Provider: Nanocenter, Duration: 40 hours (flexible), Level: Advanced

Hybrid devices – fabrication, test and measurement

Course will provide training in advanced fabrication of hybrid devices, which includes stacked heterostructure devices and superconducting/2D material devices. Fabrication will be performed in an inert atmosphere (i.e. glovebox), and measurements will be performed in a cryogenic chamber.

Provider: Nanocenter, Duration: 40 hours (flexible), Level: Advanced

Nanofabrication

Course on nanofabrication will provide opportunity to learn the device fabrication techniques together with the associated control and characterization methods with the emphasis on hands on experience. Participants will get complete insight into the fabrication steps starting from the sample preparation and handling, preparation of the required CAD files and executables, use of e-beam lithographic patterning, thin film deposition, control of procedures using optical, SEM, FIB AFM, and similar characterization/analyses and electrical testing/measurements. The course will include advanced processing in controlled environments e.g. in inert glove-box atmosphere and vacuum.

Provider: Nanocenter, Duration: 40 hours (flexible), Level: Advanced

Laser lithography

Course will introduce principles of laser lithography, its advantages, limits and its application possibilities. It will offer hands-on experiece of lithographic patterning of the photoresist with the laser. At the end of the course individually trained students will be capable to perform the laser lithography independently.

Provider: Nanocenter, Duration: 20 hours (flexible), Level: Advanced

Hands-on training on Focused Ion Beam (FIB)

In the first step the trainees will learn the basics of scanning electron microscopy (SEM) and FIB operations. Trainees will learn how to make chips using FIB Pt deposition for scientific applications. Then they will learn how to perform electron beam lithography using FIB with nanometre precision for the preparation of chips. They will also learn how to perform analysis of defects on chips with the cross-section technique. Defects will be thoroughly analysed using Energy-Dispersive X-Ray Spectroscopy (EDS) chemical analysis and with Scanning Transmission Electron Microscopy (STEM). For detailed 3-D analysis of samples on nanometre scale FIB tomography technique will be demonstrated. If there will be interest, also FIB lamella preparation training is also possible. The trainees will be able to use FIB during training under direct supervision of our instructors.

Provider: Nanocenter, Duration: 30 – 40 hours (flexible), Level: Advanced

Additional information:

Trainings are organised upon request and tailored to the participant’s background and equipment availability.

Kje:

Nanocenter, Jamova cesta 39, Ljubljana, Slovenia

Kdaj:

Flexible (depending on the selected course)

Contact:

For all information contact CC-Chip.si main office.

E-mail: office@cc-chip.si

Rok za prijavo:
applications accepted on ongoing basis.

Submit your application using the form below.

INTERESTED?

APPLY HERE

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UNIVERSITIES AND RTOs of CC CHIP.SI

University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits

University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS

 

University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization

Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design

CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)

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