Webinar: Chips Venture Forum 2026 – priložnost za rast zagonskih podjetij na področju polprevodnikov

Join an upcoming webinar presenting the Chips Venture Forum 2026, where startups can learn about the programme structure, selection process, and expected outcomes. The session is designed to help startups better understand the opportunity and assess their readiness to apply. When: 23 April 2026, 1:00 PM CEST Application deadline: 25 February 2026 Where: Online Registration: https://www.blumorpho.com/webinar/?webinarKey=9115212432889849174 […]

EuroCDP Venture Building Programmes forEuropean Startups

EuroCDP is launching its Venture Building Programmes — acceleration and incubation support for European fabless startups, with access to IC design tools, expert support, and a network focused on building the next generation of semiconductor ventures in Europe. When: 8 April 2026, 15:00 CET Application deadline: / Where: Online Registration: Launch your fabless future – Webinar […]

SEMICON Europa 2026

SEMICON Europa is the largest European electronics platform connecting industry leaders across the entire design and manufacturing supply chain. It is held annually, alternating with productronica and electronica, and is organized by SEMI Europe. Organized by SEMI Europe, SEMICON Europa co-located with productronica / electronica is the largest European electronics platform connecting industry leaders across the […]

SEMI – Zagotavljanje varnosti dobavne verige v proizvodnji polprevodnikov

An interactive workshop focused on strengthening cybersecurity and supply chain assurance in semiconductor manufacturing. The session introduces the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) and its standardized Semiconductor Supplier Cybersecurity Assessment (SSCA) framework, offering insights into evidence mapping for compliance, best practices aligned with widely accepted cybersecurity functions, and collaborative discussion with industry experts. Key information […]

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UNIVERSITIES AND RTOs of CC CHIP.SI

University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits

University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS

 

University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization

Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design

CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)

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