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The CC will provide support on you initial steps in order to provide answers to your questions, identify experts and organizations to accelerate your journey from idea to the final products in a form or semiconductor, photonic chip or quantum device.

There are several ways how you can get in contact with CC Chip.si: Contact our main office: CC Chip.si main office located at the Faculty of Electrical Engineering, Tržaška 25, 1000 Ljubljana, Slovenia, office@cc-chip.si, Phone: +386 (0)1 476 8850 Reach out to contact persons: Prof. Dr. Janez Krč, project coordinator Jurij Podržaj, technical lead: Jurij.Podrzaj@fe.uni-lj.siKlara Anžur, business lead: Klara.Anzur@fe.uni-lj.siVia consortium partners – here. You can also subscribe to the CC Chip.si weekly newsletter and follow our activites on LinkedIN.

What services you offer?

CC Chip.si provides services such as: Provide and execute Trainings, (https://cc-chip.si/offer/#trainings) -> Courses catalogue (https://cc-chip.si/wp-content/uploads/2026/01/CC-Chip.si-COURSES-CATALOGUE-V1.0-1.pdf) Organise Workshops and conferences (https://cc-chip.si/offer/#WORKSHOPS) Access to the advanced Technology infrastructure and equipment, (https://cc-chip.si/offer/#TECHNOLOGY) Consultancy on equipment access, proof-of-concept and others (https://cc-chip.si/offer/#CONSULTING) Networking on natilan and EU level to strengthen EU semiconductor ecosystem (https://cc-chip.si/offer/#NETWORKING)

How can I get in touch with other Comepetnce centers in Europe?

There are 30 CC in EU; each or CC can be either reach directly, via aCCCess and /or via CC Chip.si main office.

What are the prices of your services?

For further details and conditions, please follow the link to our price list that is COMMING SOON and please contact CC Chip.si main office here.

Sensor and Actuator Structures and Technologies in LMSE

About the training:

The Laboratory of Microsensor Structures and Electronics (LMSE) at the Faculty of Electrical Engineering, University of Ljubljana, covers a comprehensive spectrum ranging from theoretical analysis and technological fabrication to the final characterization of advanced semiconductor structures, microsensors, and microwave and sensor electronics. The training will highlight key structures and technological achievements, including silicon planar technology and cleanroom processing (ISO class 5), DRIE silicon microfabrication, silicon photodiode and optical PSD sensors, X-ray detectors for mammography, piezoresistive and mechanical stress sensors (SSMN), microfluidic and Lab-on-a-Chip (LOC) systems, micro-energy and thermal systems (catalytic microreactors and micro-thermocyclers), as well as dedicated pneumatic MEMS microvalves and oceanographic CTD instruments.

Prerequisites:

None

Language: Slovenian

When: 24.9.2026 at 9:00 AM

Where: University of Ljubljana, Faculty of Electrical Engineering, Tržaška 25, Ljubljana

Overview of the Programme (detailed program will be published soon)

Silicon planar technology, materials processing, and Deep Reactive Ion Etching (DRIE)
Silicon photodiode sensors and 1D/2D optical position-sensitive detectors (PSD).
Radiation and biomedical detectors (X-ray sensors for mammography).
Piezoresistive, pressure, and mechanical stress sensors (SSMN).
Microfluidic structures, Lab-on-a-Chip (LOC) systems, and microneedles.
Micro-energy and thermal systems (catalytic microreactors and micro-thermocyclers).
Dedicated pneumatic MEMS microvalves and oceanographic CTD instruments.

Learning Outcomes

Understanding of advanced microfabrication processes, characterization methods, and practical applications of silicon-based sensors, MEMS, and microfluidic structures.

Additional Information:

Cost: Free of charge

Organizer:

CC-Chip.si in collaboration with The Laboratory of Microsensor Structures and Electronics (LMSE) at the Faculty of Electrical Engineering, University of Ljubljana

Registration:

Until full registration capacity is reached.

Contact:

For all additional infomration please contact CC Chip.si main office by email: office@cc-chip.si