ACTIVE
Chips Act 2.0 – what’s next for Europe’s semiconductor ecosystem?
The European Commission has launched an implementation dialogue on the
The European Commission has launched an implementation dialogue on the
Join an upcoming webinar presenting the Chips Venture Forum 2026,
Applications are open for the EuroCDP Venture Development Programme 2026,
EuroCDP is launching its Venture Building Programmes — acceleration and
On 7 March 2026, the national Competition in Technology Knowledge
University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits
University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS
University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization
Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design
CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)