We provide you a list of available national equipment for semiconductor technologies – see below. Feel free to contact us for consultations on which equipment is most suitable for your measurements, proof of concept or innovation.
We assist you to use the EU infrastructure for chip design and fabrication. The centre provides access to pilot lines and virtual design platforms, supporting testing, development, and innovation in semiconductor technologies.
Check the list of available national equipment.
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Let us help you to select proper equipment for you
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We will help you with reservation.
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Flexible and Advanced MEMS & Electronics Services: flexible production of MEMS and microelectronics.
Advanced Packaging & Chiplet European Services: advanced packaging and chiplet integration.
Let us help you to access and use services of EU Design platform in designing your new chip.
University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits
University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS
University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization
Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design
CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)
