Photonic Assembly Processes: From Die Prep to Optical Interfaces

This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques.  This webinar is the second of three webinars about packaging technologies for photonics. When: 2nd April 2026,  from 2 pm to 3:30 pm CEST Where: Online event […]

INTERCHIP School on Sustainable Integrated Sensors and Systems

When: June 8th – June 11th Application deadline: 1st March, 2026 Where: INFRACHIP at Tyndall National Institute in association with European Chips Skills Academy (ECSA), CONNECT Research Centre for Future Networks,, FERNS- MSCA doctoral network & the SiNANO Academy About the training: This school will offer a programme combining lectures, hands‑on sessions, and expert discussions. It […]

INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment

When: June 23th – June 24th, 2026 application deadline: 31st March, 2026 Where: Organised by MC2, Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Göteborg, Sweden & GOMOD AB (Sweden) About the training: Microfabrication and electrical characterization (S-parameters) of a MEM piezoelectric device microfabrication in the tools and facilities at the department of Microtechnology and […]

ECS Summer School – European Chips Skills Academy

A multi-day residential summer school introducing students to semiconductor systems, IC design, and ECS technologies, organised within the ECSA framework. When: August 23th – August 28th, 2026 Application deadline: 29 March 2026  Where: University Residential Centre, University of Bologna, Bertinoro, Italy About the programme: Via lectures, demonstrations and interactive activities, the program will introduce some of the […]

Dresden Microelectronics Academy – TU Dresden (Germany)

An intensive summer academy highlighting micro- and nanoelectronics technologies in one of Europe’s largest microelectronics hubs. When: applications opens in Spring 2026 Where: TU Dresden (Germany) Who can apply What can you expect Learn more here.

Advanced PDK Workshop: N2–A14 Nanosheet Pathfinding & Applications

2-day workshop with hands-on practical sessions (limited spaces) Course overview This intensive two-day advanced workshop provides a deep dive into N2 and A14 Nanosheet Pathfinding-PDK (P-PDK) technologies, with a strong focus on digital design flows and Back-Side Power Distribution Networks (PDN). Participants will gain a comprehensive understanding of: The course combines expert-led lectures with hands-on […]

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UNIVERSITIES AND RTOs of CC CHIP.SI

University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits

University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS

 

University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization

Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design

CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)

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