Photonic Assembly Processes: From Die Prep to Optical Interfaces
This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. This webinar is the second of three webinars about packaging technologies for photonics. When: 2nd April 2026, from 2 pm to 3:30 pm CEST Where: Online event […]
INTERCHIP School on Sustainable Integrated Sensors and Systems
When: June 8th – June 11th Application deadline: 1st March, 2026 Where: INFRACHIP at Tyndall National Institute in association with European Chips Skills Academy (ECSA), CONNECT Research Centre for Future Networks,, FERNS- MSCA doctoral network & the SiNANO Academy About the training: This school will offer a programme combining lectures, hands‑on sessions, and expert discussions. It […]
INTERCHIP Training: Hands-on MEM microfabrication in cleanroom environment
When: June 23th – June 24th, 2026 application deadline: 31st March, 2026 Where: Organised by MC2, Dept. of Microtechnology and Nanoscience, Chalmers University of Technology, Göteborg, Sweden & GOMOD AB (Sweden) About the training: Microfabrication and electrical characterization (S-parameters) of a MEM piezoelectric device microfabrication in the tools and facilities at the department of Microtechnology and […]
ECS Summer School – European Chips Skills Academy
A multi-day residential summer school introducing students to semiconductor systems, IC design, and ECS technologies, organised within the ECSA framework. When: August 23th – August 28th, 2026 Application deadline: 29 March 2026 Where: University Residential Centre, University of Bologna, Bertinoro, Italy About the programme: Via lectures, demonstrations and interactive activities, the program will introduce some of the […]
Dresden Microelectronics Academy – TU Dresden (Germany)
An intensive summer academy highlighting micro- and nanoelectronics technologies in one of Europe’s largest microelectronics hubs. When: applications opens in Spring 2026 Where: TU Dresden (Germany) Who can apply What can you expect Learn more here.
Advanced PDK Workshop: N2–A14 Nanosheet Pathfinding & Applications
2-day workshop with hands-on practical sessions (limited spaces) Course overview This intensive two-day advanced workshop provides a deep dive into N2 and A14 Nanosheet Pathfinding-PDK (P-PDK) technologies, with a strong focus on digital design flows and Back-Side Power Distribution Networks (PDN). Participants will gain a comprehensive understanding of: The course combines expert-led lectures with hands-on […]
Trainings on YouTube – Austrian Chips Competence Center
Free learning videos are available on YouTube and the selection is continuously expanding. Watch them already now or use them in your own trainings. More trainings avaiable here
More trainings
More trainings available here.
Ugrade of integrated photonics course at UL FE
At the University of Ljubljana, Faculty of Electrical Engineering, the Master’s-level elective course Photonics focuses primarily on integrated photonics. The course consists of lectures and a hands-on lab course. The lab part of the course has recently been updated to emphasize an extensive hands‑on approach: students design, simulate, lay out, and measure a complete project […]
More Trainings Coming Soon
Additional training courses in the field of chips, electronics and semiconductor technologies are currently in preparation.
