WHO WE ARE

ABOUT US

We are consortium of 6 institutions with broad expertise and knowledge in the field of chips and semiconductor technologies.

The consortium is coordinated by the Faculty of Electrical Engineering, University of Ljubljana.

MEET

CC CHIP.SI MAIN OFFICE TEAM

Klara Anžur
Business Lead

Klara.Anzur@fe.uni-lj.si
+386 1 476 88 50

Jurij Podržaj
Technical Lead

Jurij.Podrzaj@fe.uni-lj.si
+386 1 476 88 50

Janez Krč
CC Chip.si coordinator

Janez.Krc@fe.uni-lj.si
+386 1 476 8843

meet

PROJECT CORE TEAM

Representatives of the partner institutions of the CC Chip.si. 

From left to right, back row: Dr. Jurij Podrža (UL FE), Matej Poljanšek (UL FE), Dr. Anže Mraz (Nanocenter), Prof. Dr. Tadej Tuma (UL FE), Dr. Verdan Budinski (UM FERI), Prof. Dr. Patricio Bulić (UL FRI), Prof. Dr. Dr. Denis Đonlagić (UM FERI); center: Prof. Dr. Janez Trontelj (UL FE), Dr. Marijan Leban (IJS); front row: Prof. Dr. Marko Topič (UL FE), Barbara Paternoster (IJS), Prof. Dr. Janez Krč (UL FE), Prof. Dr. Egon Pavlica (UNG).

BE PART OF

Our Mission

We aim to give a new push to Slovenian microelectronics, nanoelectronics, photonics and quantum technologies through our activities and services.

We strive to bring a new momentum to semiconductor sector in Slovenia as a part of EU and global market. Niche semiconductor solutions are key drivers to locate small country like Slovenia on a global map of players in semiconductor industry.

potential

USERS

Companies, RTOs, universities and other stakeholders involved in the field of chips and semiconductor technologies are welcome to use our services.
Several Slovenian stakeholders signed MoU on intention to collaborate in the field of microelectronics and semiconductors.

MoU on intention to collaborate in the field of microelectronics and semiconductors (COMING SOON)

about the

BACKGROUND

Slovenian Competence Center on Chips and Semiconductor Technologies – CC Chip.si (KC Čip.si) is one of the 30 Chips competence centers in EU that have been lunched in the frame of the Chips for Europe initiative under umbrella of European Chips Act. The Competence center was set as one of the key actions in Slovenian national strategic plan for digital decade and in the forthcoming National program for chips and semiconductor technologies development until 2030.

As such CC Chip.si is the central hub for rreinforcing research, development, innovation and business in in the field of chips and semiconductor technologies in Slovenia and Europe.

our main

ACTIVITIES AND SERVICES

Our activities and services are, according to the EU regulations for Chips Competence centers, focused on:

  • promotion of the field,
  • skills development and education,
  • technology access and
  • networking.

Promotion

Skills

Technology

Networking

GET TO KNOW

OUR FOCUS AREAS

Focus areas of CC Chip.si is two fold:

  • Application specific electronic chipr (ASIC) and
  • Photonic and quantum chips, presenting new emerging generations of chips.

GET IN TOUCH WITH US

CC Chip.si as a one-stop shop

The CC Chip.si is an entry point for companies (especially SMEs and start-ups) RTOs, universities and other stakeholders to provide and facilitate access to trainings, modern technologies (such as Chips JU Pilot lines and Virtual Design platform and others), services of other Chips Competence Centers and more. 

ADDITIONAL INFORMATION

Duration of the
project & Workpackages

The 4-year project CC Chip.si started on 1.3.2025 and will finish on 28.2.2029.

Within 6 work packages 4 main pillars (accelerators) have been defined with their specific tasks.

Active support to companies, RTOs, universities and other stakeholders.

CC CHIP.SI

Project financing

The project is funded by the Ministry for Digital Transformation of the Republic of Slovenia and the Chips Joint Undertaking (Chips JU) under the Digital Europe Programme (DIGITAL–Chips–2024–SG–CCC–1).

The total budget is 4 mio EUR for 4 year of project duration (1.3.2025 – 28.2.2029).

OPENING THE SCOPE

LINKS to relevant sites

Network of chips competence centers

Chips joint undertaking

European Semiconductor Industry association

European Semiconductor regions alliance

Bridging semiconductor industry talent gap

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UNIVERSITIES AND RTOs of CC CHIP.SI

University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits

University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS

 

University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization

Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design

CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)

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