How can I help with the Competence center?

The CC will provide support on you initial steps in order to provide answers to your questions, identify experts and organizations to accelerate your journey from idea to the final products in a form or semiconductor, photonic chip or quantum device.

There are several ways how you can get in contact with CC Chip.si: Contact our main office: CC Chip.si main office located at the Faculty of Electrical Engineering, Tržaška 25, 1000 Ljubljana, Slovenia, office@cc-chip.si, Phone: +386 (0)1 476 8850 Reach out to contact persons: Prof. Dr. Janez Krč, project coordinator Jurij Podržaj, technical lead: Jurij.Podrzaj@fe.uni-lj.siKlara Anžur, business lead: Klara.Anzur@fe.uni-lj.siVia consortium partners – here. You can also subscribe to the CC Chip.si weekly newsletter and follow our activites on LinkedIN.

What services you offer?

CC Chip.si provides services such as: Provide and execute Trainings, (https://cc-chip.si/offer/#trainings) -> Courses catalogue (https://cc-chip.si/wp-content/uploads/2026/01/CC-Chip.si-COURSES-CATALOGUE-V1.0-1.pdf) Organise Workshops and conferences (https://cc-chip.si/offer/#WORKSHOPS) Access to the advanced Technology infrastructure and equipment, (https://cc-chip.si/offer/#TECHNOLOGY) Consultancy on equipment access, proof-ofo-concept and others (https://cc-chip.si/offer/#CONSULTING) Networking on natilan and EU level to strengthen EU semiconductor ecosystem (https://cc-chip.si/offer/#NETWORKING)

How can I get in touch with other Comepetnce centers in Europe?

There are 30 CC in EU; each or CC can be either reach directly, via aCCCess and /or via CC Chip.si main office.

What are the prices of your services?

For further details and conditions, please follow the link to our price list that is COMMING SOON and please contact CC Chip.si main office here.

INTERCHIP School on Sustainable Integrated Sensors and Systems

When: June 8th – June 11th

Application deadline: 1st March, 2026

Where: INFRACHIP at Tyndall National Institute in association with European Chips Skills Academy (ECSA), CONNECT Research Centre for Future Networks,, FERNS- MSCA doctoral network & the SiNANO Academy

About the training:

This school will offer a programme combining lectures, hands‑on sessions, and expert discussions. It will cover key topics such as sensor fundamentals (electrochemical, electrical, and photonic), fabrication workflows, packaging and integration, IP and patent mapping, sustainability in sensor development, and emerging technologies. Participants will also benefit from dedicated sessions on sensor characterisation, RF sensing, and analog front‑end circuits. The programme includes a Tyndall lab tour, a career session, and a full‑day hackathon with final presentations.

Learn more here.