Student visit to the Embedded world 2026

March 17, 2026

As part of the University of Ljubljana, Faculty of Electrical Engineering study programme in Electrical Engineering – Electronics, Electronics department co-financed and organised a student visit to the embedded world 2026 trade fair.

CC-Chip.si was also there, presented its activities and highlighted study opportunities in the fields of integrated analog, mixed-signal and digital circuit design, as well as integrated photonic circuits.

Students also learned more about the supporting environment provided by CC-Chip.si, both within the Slovenian consortium and through network of Competence Centres across Europe.

UL FE Students at Embedded world 2026 with KC Čip.si

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UNIVERSITIES AND RTOs of CC CHIP.SI

University of Ljubljana
UL FE & UL FRI
• cleanroom facilities sub-micron (Bi)CMOS
• mixed signal ASIC design, FPGA, RISC
• THz sensors and arrays, MEMS
• Si based photonic integrated circuits

University of Maribor
FERI
• mixed signal ASIC design (flight-proven chips)
• advanced waveguide and fiber sensor solutions
• micromachining technologies, MEMS, MOEMS

 

University of Nova Gorica
• organic electronics
• graphene based devices
• electro-optical characterization

Jožef Stefan Institute
• material research
• radiation detectors
• quantum technology
• thin-film chip related technologies
• ASIC design

CoE Nanoscience & Nanotechnology
Nanocenter
• nanofabrication facilities
• advanced quantum devices (supercond. transmon qubits)
• energy-efficient ultra fast memory (cryo, quantum)

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