{"id":35024,"date":"2026-04-08T13:01:06","date_gmt":"2026-02-28T08:32:52","guid":{"rendered":"https:\/\/cc-chip.si\/?p=34714"},"modified":"2026-04-08T13:11:15","modified_gmt":"2026-04-08T13:11:15","slug":"eurosime-2026-27th-intentional-conference-on-thermal-mechanical-and-multiphysics-simulation-and-experiments-in-microelectronics-and-microsystems","status":"publish","type":"post","link":"https:\/\/cc-chip.si\/slo\/eurosime-2026-27th-intentional-conference-on-thermal-mechanical-and-multiphysics-simulation-and-experiments-in-microelectronics-and-microsystems\/","title":{"rendered":"EuroSimE 2026 &#8211; 27th Intentional conference on Thermal, Mechanical, and Multiphysics simulation and experiments in Microelectronics and Microsystems"},"content":{"rendered":"<p>27th International Conference on Thermal, Mechanical and Multi-Physics<br>Simulation and Experiments in Microelectronics and Microsystems<\/p>\n\n\n\n<p>EuroCDP is launching its Venture Building Programmes \u2014 acceleration and incubation support for European fabless startups, with access to IC design tools, expert support, and a network focused on building the next generation of semiconductor ventures in Europe.<\/p>\n\n\n\n<p><strong>Kdaj<\/strong>: 19-22 April 2026<\/p>\n\n\n\n<p><strong>Rok za prijavo: <\/strong><\/p>\n\n\n\n<p><strong>Kje<\/strong>:\u00a0Warsaw, Poland<\/p>\n\n\n\n<p><strong>Registracija:<\/strong> <a href=\"https:\/\/eurocdp.eu\/news-updates\/launch-your-fabless-future-webinar-8-april-2025-1500-cet\/\">https:\/\/www.eurosime.org\/registration\/<\/a><\/p>\n\n\n\n<p><strong>O programu:<\/strong><\/p>\n\n\n\n<p>The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro\/nano-electronics and microsystems.<\/p>\n\n\n\n<p>Professional training courses will be offered on April 19, 2026 followed by three days of technical sessions (April 20\u201322, 2026) comprising of oral and poster presentations, including industry keynote talks by invited speakers. In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation\/optimization software will showcase their latest features.<\/p>\n\n\n\n<p><strong>Cost: <\/strong>950,00 EUR<\/p>\n\n\n\n<p>More about the event here: https:\/\/www.eurosime.org\/<\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>27th International Conference on Thermal, Mechanical and Multi-PhysicsSimulation and Experiments in Microelectronics and Microsystems EuroCDP is launching its Venture Building Programmes \u2014 acceleration and incubation support for European fabless startups, with access to IC design tools, expert support, and a network focused on building the next generation of semiconductor ventures in Europe. When: 19-22 April [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":35026,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[6,1],"tags":[12],"class_list":["post-35024","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-other-workshops-conferences","category-workshops","tag-active"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/posts\/35024","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/comments?post=35024"}],"version-history":[{"count":1,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/posts\/35024\/revisions"}],"predecessor-version":[{"id":35027,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/posts\/35024\/revisions\/35027"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/media\/35026"}],"wp:attachment":[{"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/media?parent=35024"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/categories?post=35024"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/cc-chip.si\/slo\/wp-json\/wp\/v2\/tags?post=35024"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}