This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. <\/p>\n\n\n\n
This webinar is the second of three webinars about packaging technologies for photonics.<\/p>\n\n\n\n
Kdaj<\/strong>: 2nd April 2026, from 2 pm to 3:30 pm CEST <\/p>\n\n\n\n Kje<\/strong>: Online event<\/p>\n\n\n\n About the training:<\/strong> This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot-size converters, creation of robust optical interfaces, and approaches to thermal packaging. Attendees will gain a clear understanding of the full photonic assembly workflow and the process controls that enable high-quality, repeatable results.<\/p>\n\n\n\n Cost<\/strong>: This webinar is free<\/p>\n\n\n\n More about event: <\/strong>photonixFAB webinars on packaging technologies for photonics: Part 2 – Training – ePIXfab<\/a><\/p>\n\n\n\n